Abstract: The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to overcome ...
Abstract: Plastic encapsulation is a key feature for System-in-Package (SiP) technology as it provides robust mechanical protection and structural support for all the electronic components enclosed ...
As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified transportation—researchers at the National Renewable Energy Laboratory have unveiled a ...
Tesla CEO Elon Musk announced on social media that the automaker's Full Self-Driving system will become exclusively available as a subscription service after February 14. The Full Self-Driving feature ...
Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 Size L-compliant SOM-iMX95-OSM and the SMARC 2.1-compliant SOM-iMX95-SMARC ...
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