注意,如果是 Mac 或者 Ubuntu 启动时需要在 packages/app/packages.json 文件里吧 scripts 字段里的 dev 字段 改成 "tsc && electron ." 删除掉 ...
Abstract: Package degradation for high power insulated gate bipolar transistors (IGBTs) modules would seriously affect the operation safety of power electronic converters. Due to the variety of ...
Please take a look at the feature list below to see the currently supported features. For examples, take a look into the examples folder. You can also check the test cases, every feature is tested.
Abstract: Within the expanding domain of electrical power demand, the future of power module packaging is entwined with the progress of (ultra) wide bandgap [(U)WBG] materials. These materials, such ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results