Abstract: In this study, fan-out panel level packaging (FO-PLP) technology using redistribution layer (RDL) first approach is demonstrated using Gen-3 glass substrate (550mm × 650mm size).
Abstract: In this paper, a 2DOF FO PID (2 Degrees of Freedom Fractional Order Proportional Integral Derivative) controller is employed to control the angular position of the rotational load of a ...
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