Abstract: In this article, a deep reinforcement learning (DRL) approach that optimizes the power/ground ball map design within the ball grid array (BGA) package of 3-D-integrated circuits (ICs) ...
Abstract: To minimize the effect by asymmetry of package, a novel chip-level thermal management method is proposed in this article, whereby the heat generated by the central heating resistor is ...
They come in flavours like bubble gum, pink lemonade and red gummy bear. They resemble the kind of silica gel packet you find in packaged food, but instead of sucking up moisture, they’re placed in ...
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