High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
Abstract: This paper demonstrates the need for temperature awareness in sizing accelerators to target multi-DNN workloads. To that end, we build TESA, a TEmperature-aware methodology that Sizes and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results