Nasdaq

Ansys Multiphysics Solutions Certified By TSMC For High-Speed Next-Generation 3D-IC Packaging Technologies

Ansys (NASDAQ: ANSS) achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS® with silicon interposer (CoWoS®-S) and InFO with RDL interconnect (InFO-R) ...
Seeking Alpha

Ansys Enables 3D Multiphysics Visualization of Next-Generation 3D-IC Designs with NVIDIA Omniverse

Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...
Seeking Alpha

Ansys 2024 R1 Reimagines the User Experience while Expanding Multiphysics Superiority Boosted by AI

Modern Ansys Design Language elevates the user experience (UX) to create a new user interface (UI) paradigm across the Ansys (ANSS) multiphysics portfolio and increases accessibility Native Ansys ...
Nasdaq

Ansys Multiphysics Solutions Certified for Samsung Foundry's Entire Line of FinFET Process Technologies

Ansys achieved new certifications of its leading-edge suite of semiconductor design solutions for all Samsung Foundry FinFET process nodes Ansys® RedHawk-SC™ was added to the certified suite to design ...