EDN

Wafer Level Chip Size Package

This application note provides guidelines for the use of Wafer Level Chip Size Packages (WLCSP). The information in this application note can be used throughout the various stages of WLCSP use. This ...
EDN

Reportlinker Adds Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in Substrate

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...
Nasdaq

Akoustis Locks Process Flow for First Wafer-Level-Chip-Scale Package (WLCSP) for XBAW Filters

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
Electronic Design

Wafer-Level Chip-Scale Package Favors Small-Form-Factor ASICs

A fully qualified, high-performance, low-power and small-form-factor wafer-level chip-scale package (W-CSP) developed by Oki Semiconductor satisfies a wide range of ASIC design demands. Targeting chip ...
Nasdaq

Akoustis Completes Wafer Level Package Demonstrator and Ships Sample to Tier-1 Mobile Device OEM

Las Vegas, NV, Jan. 09, 2020 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) ...
Semiconductor Engineering

Easing The Stress For Package-Level Burn-In

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...
Business Insider

Akoustis Locks Process Flow for Second Wafer Level Package for XBAW Filters

Charlotte, N.C., May 03, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) ...
Yahoo Finance

Aehr Seeing Momentum in Package-Level Burn-In Alongside Expanding Wafer-Level Burn-in Demand

FREMONT, CA / ACCESS Newswire / November 12, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced the shipment of its Dual-Echo™ ...
Semiconductor Engineering

The Next Advanced Packages

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...
Business Wire

OmniVision’s New Medical Wafer-Level Camera Module Improves Image Quality for Single-Use Endoscopy in Smallest Parts of Anatomy

SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVMed® OCHTA camera module with quadruple the ...
Business Insider

Akoustis Completes Wafer Level Package Demonstrator and Ships Sample to Tier-1 Mobile Device OEM

– WLP Package Footprint Enables Form Factor Suitable for 5G Mobile Device Market – – Qualified WLP Packaging Expected in the Second Half of CY20 – Las Vegas, NV, Jan. 09, 2020 (GLOBE NEWSWIRE) -- ...