The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...
This application note discusses Maxim Integrated’s patented 1-Wire® Contact Package solution for electro-mechanical contact applications. It discusses traditional packaging solutions and demonstrates ...
The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and ...
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