Chip testing has become increasingly complex due to the number of variables impacting designs – from design size and complexity, to high transistor counts on advanced technology nodes, to 2.5D/3D ...

Patterns created using advanced fault models provide higher test coverage, improved defect detection, and higher-yielding ...

Integrated circuit complexity and integration continuously advances, posing challenges to the development process. Market profitability, however, demands that products be designed and produced as fast ...

Yield improvement at sub 100-nm technologies relies on the latest scan test techniques. As IC feature sizes shrink below 90 nm, in-line inspection techniques to determine yield-limiting problems ...

Scan technology was developed as a structured test technique that divided the complex sequential nature of a design into small combinational logic blocks that could be tested individually. This added ...

In-circuit test (ICT) systems have been the leaders in using electrical means to look for structural defects in PCBs. They employ bed-of-nails fixtures to provide electrical access to as many as 7000 ...