Although consumers care about the products they buy, the packaging matters, too. It is a similar concern for company leaders. An insufficient package could result in goods arriving spoiled, broken or ...

Oliver Campbell, Dell Technologies’ Director of Procurement & Packaging Engineering, has been with the tech innovation vanguard for more than half the company’s 39-year existence. At that time, the ...

AAMI, the Association for the Advancement of Medical Instrumentation, announces the AAMI Foundation's Dr. Michael Scholla ...

Medical packaging sits at the intersection of materials science, sterilization, human factors, and global regulatory ...

This concentration is designed to equip practitioners with the tools necessary to meet tomorrow’s challenges concerning packaging and its sustainability in the associated supply chains. To this end, ...

Packaging science goes far beyond mere protection and containment. It's a bridge between products and consumers, serving as a powerful tool for marketing, sustainability, and innovation. This is where ...

Genesis learns art and engineering are a “package deal” with Packaging Engineer Camille Corr Chism! Genesis joins professor Camille Corr Chism at Michigan State University’s School of Packaging, where ...

What happened to Tim Dehm in Vegas won’t stay in Vegas. The fourth-year packaging science student from RIT brought home a $2,500 scholarship from this year’s Pack Expo and Conference, an annual ...

RIT’s print and graphic media technology curriculum is being integrated into the university’s packaging science program.

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced ...

The first student has completed the University of Nevada, Reno's Nuclear Packaging Graduate Certificate program, the only such program in the nation. Daniel Perlstein, an employee of the Nevada ...

Number of options for adding more features into chips grows beyond just 2.5D and 3D as mainstream packaging technologies run out of steam. Apple, Samsung and others are developing the next wave of ...