Mitsubishi Electric Corporation announced it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of ...
ROHM is now mass-producing the industry’s first trench-type SiC MOSFET. Utilizing a proprietary trench structure, the process results in improved switching performance (approx. 35% lower input ...
Renesas today announced the RJK0383DPA, a dual-type power MOSFET that enables smaller, higher-efficiency synchronous-rectification DC/DC converters for generating various supply voltages in ...
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