CHANDLER, Arizona — Amkor has started using proprietary processes to create both lidded and fully molded cards in the MultiMedia and SecureDigital card (MMC/SDC) formats using a lead-frame packaging ...

Dublin, July 09, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Lead Frame Market - Forecasts from 2025 to 2030" report has been added to ResearchAndMarkets.com's offering. The semiconductor lead frame ...

Amkor Inc. is halfway through converting its lead-frame-package manufacturing capacity to a standard matrix assembly and test format. In the past two years, the Chandler, Ariz., supplier of packaging ...

Lead frame surface oxidation can lead to surface delamination after molding or wire bonding issues. The application of plasma treatment has been proven to be safe and effective solution to address ...