Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...
KLA-Tencor Corp. hopes to open a new market for wafer backside inspection with the introduction of an automated wafer backside inspection module today for its Surfscan 300mm-defect inspection tool.
In this interview, Mark Bumiller, Technology Manager for Entegris talks to AZoM about using the Accusizer to detect large particles counts in CMP slurries. Please could you give us an introduction to ...
As demand for device slips below 0.18m m, are relying more machinable help get silicon wafers through the fab line quickly with less consumable costs and fewer defects per wafer. OEMs and fabs want to ...
PHOENIX, Ariz. and HSINCHU, Taiwan — September 12, 2007— Rohm and Haas Electronic Materials, CMP Technologies, a leader and innovator in chemical mechanical planarization technology for the global ...
Use of machine learning and feed-forward neural networks presents a new and exciting opportunity to develop high-accuracy CMP models of complex, advanced deposition processes. Machine learning (ML), ...
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