A research team led by Dr. Jeong Min Park of the Nano Materials Research Division at the Korea Institute of Materials Science ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
Late defect discovery erodes yield, profit, and reliability. Here’s why inspection coverage and failure analysis drive ...
MILPITAS, Calif., July 10, 2018 /PRNewswire/ -- Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring ...
Understanding your company’s manufacturing process and how to minimize defects has always been important. Today, its importance is increasing with the complexity of products and the customers' demand ...
With every process node advance, new types of manufacturing defects manifest. These defects are especially prevalent during the early phase. For early adopters, silicon manufacturing tests must evolve ...
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