EDN

Marvell unveils 64 Gbit/s D2D interface IP

Marvell Technology, Inc. has claimed the industry’s first 2-nm 64 Gbits/s bi-directional die-to-die (D2D) interconnect, offering higher bandwidth and efficiency together with advanced power management ...
Seeking Alpha

Marvell Unveils Industry's First 64 Gbps/wire Bi-Directional Die-to-Die Interface IP in 2nm to Power Next Generation XPUs

New D2D interface IP offers more than 3x bandwidth density of equivalent UCIe interface while requiring far less silicon Advanced power management capability automatically adapts to bursty data center ...
Business Wire

Keysight Introduces Chiplet PHY Designer for Simulating D2D to D2D PHY IP Supporting the UCIe™ Standard

Chiplet PHY simulator addresses the effects of forward clocking with single-ended signaling and higher bit error rate on die-to-die interconnect performance of ...
Semiconductor Engineering

GUC GLink Test Chip Uses In-Chip Monitoring And Deep Data Analytics For High Bandwidth Die-To-Die Characterization

Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized ...
WFLA News Channel 8

GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring

HAIFA, Israel, Oct. 26, 2022 /PRNewswire/ -- proteanTecs, a global leader of deep data analytics for advanced electronics, announced the results of its collaboration with advanced ASIC provider, ...