Business Wire

Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform

Companies advance multi-die planning and implementation, leveraging Cadence’s Integrity 3D-IC platform, the industry’s only unified platform that combines system planning, packaging and system-level ...
Nasdaq

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems The Tempus Timing ...
Nasdaq

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)-- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.
Design-Reuse

Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dbloxâ„¢ Standard

SAN JOSE, Calif.— April 26, 2023-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced new design flows based on the Cadence ® Integrity ™ 3D-IC platform to support the TSMC 3Dblox ™ standard ...
Design-Reuse

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs

SAN JOSE, Calif. -- October 26, 2021-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is working with TSMC to accelerate 3D-IC multi-chiplet design innovation. As part of the ...